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Mainly used for the flat surface pressure grinding and polishing of silicon wafer, lithium niobate, optical glass, sapphire, valve plate, mechanical seal, and super hard material.
A type machine tool has an active wheel revolving mechanism.
B type machine with rotary plate system.
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Main technical specification |
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DMYP12A-4 |
DMYP12B-4 |
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DMYP12A-4 |
DMYP12B-4 |
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Plate diameter |
Φ1200 mm |
Φ1200 mm |
Plate speed |
10~40 r/min |
10~40 r/min |
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Process range |
≤Φ440 |
≤Φ440 |
Precision of plate |
≤0.08mm |
≤Φ0.08mm |
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Process station |
4 |
4 |
Speed of drive wheel |
0~500 r/min |
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Platen speed |
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0~96 r/min |
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Total power |
12KW/380V |
15KW/380V |
Maximum pressure |
140kg |
140kg |
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Size |
1710x1710x2230(mm) |
1710x1710x2230(mm) |
Weight |
About 4000 kg |
About 4500 kg |
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All machines can be designed and manufactured as required. |
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