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LP062.6B Plane Precision Ring Polisher

  • Mainly used for the grinding and polishing of high precision optical glass quartz wafer ceramics silicon chip and sapphire. Two kinds of grinder are used: one is granite grinder and the deformation amount is very small under different ambie
  • Hotline:0510-85072226

  Mainly used for the grinding and polishing of high precision optical glass, quartz wafer, ceramics, silicon chip and sapphire.

  Two kinds of grinder are used: one is granite grinder, and the deformation amount is very small under different ambient temperature. It is suitable for grinding and polishing. The other is the cast iron grinding disc, which is suitable for fine grinding and six processing stations.

 

 Main  technical  specification

Millstone dia.

Φ620mm

Millstone rotating speed

0~90RPM

Processing scope

≤Φ170mm

Tank dia.

Φ780mm

Location number

6

Driving wheel speed

0~550RPM

Jumpiness of millstone

≤0.05mm

Total power

3KW/380V

Weight

About760kg

Size

1020x920x1350(mm)

All machine can be designed and manufactured as requirements.



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