LP10/08 Plane Precision Ring Polisher
- This equipment is mainly used for polishing and grinding high-precision plane of optical field e
- Hotline：0510-85072226
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- 0510-85072226
- Technical Quality Satisfied
0510-85072226
Mainly used for precision polishing of high precision optical glass, quartz wafer, ceramic, silicon wafer, sapphire and other planar components.
The LP10B/08B plane precision ring polisher based on the LP10A/08A increase in the active wheel rotation mechanism, for processing components play a very good function of rotation.
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Main technical specification |
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| LP10 | LP08 | LP10 | LP08 | ||
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Millstone dia. |
Φ1000mm | Φ800mm |
Tank dia. |
Φ1150mm | Φ1000mm |
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Jumpiness of millstone |
≤0.06mm | ≤0.05mm |
Processing scope |
≤Φ350mm | ≤Φ260mm |
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Millstone rotating speed |
1～8RPM | 1～10RPM |
Total power |
2.5KW/380V | 2.4 KW/380V |
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Size |
1400x1400x1070（mm） | 1300x1300x1400(mm) |
Weight |
About1200kg |
About 1000kg |
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All machines can be designed and manufactured as required. |
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